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Increase your power density with 3DPP®
Low power switching regulators, buck converters, and isolated DC/DC converters must remain cost-effective despite growing demands for higher efficiency, increased power density, and compact SMD designs. Manufacturers have responded with multiple form factors to simplify manufacturing, often using minimal component counts. However, traditional designs with transformers and inductors hand-soldered to PCBs can lead to performance losses and production challenges. To reduce PCB footprint, through-hole SIP versions are common, but these introduce assembly inefficiencies, requiring a mix of wave soldering or hand soldering alongside the reflow process for other SMT components.
Table of contents
-
Non-Isolated Power Modules
- RPH-3.0 – Integrated Inductor DC/DC Power Modules
- RPM, RPMB, RPMH – Non-Isolated LGA Power Modules
- RPX/RPY – Non-Isolated QFN Power Modules
- RPL – Integrated Inductor Non-Isolated Power Modules
- RPZ – Integrated Inductor Non-Isolated QFN Power Modules
- R-78AA-1.0 and ROF-78E – High-efficiency three-terminal linear regulator replacements
- Isolated DC/DC Converter
Increase your power density with 3D Power Packaging®
Millions of through-hole DC/DC converters are sold annually, yet RECOM’s goal has been to design variants that are fully compatible with SMT processes, enabling consistent, high-volume production without sacrificing performance. Electrical performance is enhanced with a low-profile design suitable for today’s slim-line products, while keeping the footprint small to preserve the benefits of a module over a discrete circuit. To achieve this, RECOM integrates vertical (Z-axis) space utilization through 3D packaging and assembly techniques, enabling more power conversion functionality in smaller dimensions.
RPM internal PCB visualization
RECOM’s advanced manufacturing is paired with optimized circuit and thermal design, resulting in highly efficient modules capable of sustained high-power operation at elevated temperatures. For example, the QFN-packaged RPX series measures just 3mm x 5mm x 1.6mm and delivers 1A or 1.5A output at a programmable voltage from 0.8–30VDC. While non-isolated converters continue to shrink, isolated designs face creepage and clearance constraints. RECOM applies its 3D Power Packaging expertise to minimize height, as seen in the SOIC16 RxxCxx series, which offers 2MOPP/250VAC medical-grade isolation in only 2.65mm profile.
RECOM 3D Power Packaging modules are ideal for space- and cost-critical applications in industrial, medical, networking, storage, portable electronics, imaging systems, telecom, and point-of-load power delivery for processors and FPGAs.
RECOM has introduced the term 3D Power Packaging® to describe the creation of true SMT-compatible low power DC/DC converters and power modules that outperform discrete PCB designs. Similar to how replacing a processor with a discrete setup is impractical, these modules offer integration and reliability impossible to match with component-level assembly.
Techniques in the 3D Power Packaging concept include:
Techniques in the 3D Power Packaging concept include:
- Integrated magnetics
- Control ICs embedded in multilayer substrates with buried/blind vias
- Flip-chip mounting of the IC
- Leadframe technology
- SMD terminations such as QFN, SSOP, and LGA, along with traditional gull-wing leads
RPM internal PCB visualization
RECOM’s advanced manufacturing is paired with optimized circuit and thermal design, resulting in highly efficient modules capable of sustained high-power operation at elevated temperatures. For example, the QFN-packaged RPX series measures just 3mm x 5mm x 1.6mm and delivers 1A or 1.5A output at a programmable voltage from 0.8–30VDC. While non-isolated converters continue to shrink, isolated designs face creepage and clearance constraints. RECOM applies its 3D Power Packaging expertise to minimize height, as seen in the SOIC16 RxxCxx series, which offers 2MOPP/250VAC medical-grade isolation in only 2.65mm profile.
RECOM 3D Power Packaging modules are ideal for space- and cost-critical applications in industrial, medical, networking, storage, portable electronics, imaging systems, telecom, and point-of-load power delivery for processors and FPGAs.
Non-Isolated Power Modules
Non-isolated DC/DC converters share a common input and output ground and are used when galvanic isolation is not required. Voltage conversion can be achieved using a linear regulator (often inefficient) or a buck/boost switching regulator. The switch chops the input voltage with a variable duty cycle, while an inductor-capacitor network filters the waveform back to DC. Without a transformer, these designs remain compact and efficient, even at high voltage ratios.
In many cases, RECOM modules can directly replace linear regulators, providing dramatic efficiency gains, eliminating heatsinks, and freeing valuable PCB space. With 3D Power Packaging, non-isolated converters become tightly integrated power modules combining semiconductors and magnetics for optimal performance.
In many cases, RECOM modules can directly replace linear regulators, providing dramatic efficiency gains, eliminating heatsinks, and freeing valuable PCB space. With 3D Power Packaging, non-isolated converters become tightly integrated power modules combining semiconductors and magnetics for optimal performance.
RPH-3.0 – Integrated Inductor DC/DC Power Modules
The RECOM RPH-3.0 is a compact 3A buck converter power module in a 10 x 12 x 4mm QFN SMD package, featuring integrated shielded inductors and flip-chip control IC mounting for superior thermal performance. It supports 4.5–55VDC input from sources like 36V or 48V Li-ion batteries or standard 5V, 12V, 24V, and 48V supply rails.
Features:
- Buck regulator module with integrated shielded inductor
- 4.5–55VDC input range
- Programmable 1–15V output
- 3A max output current
- SCP, OCP, OVP, and UVLO protection
- 10mm x 12mm x 4mm QFN package
- Flip-chip for improved heat dissipation
- Efficiency up to 91%
- Operation up to 125°C with derating
- Programmable 100kHz–1MHz switching frequency
- Signals/control: PGOOD, ON/OFF
| Series | Current (A) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||||
|---|---|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPH-3.0
Focus
| 3 | 4.5 - 55 | 1 to 15 | SMD (pinless) | 47-Pad QFN | |||
| 2 |
|
RPH-3.0-EVM-1
Focus
| 3 | 4.5 - 55 | 1 to 15 | Open Frame |
RPM, RPMB, RPMH – Non-Isolated LGA Power Modules
The RECOM RPM, RPMB, and RPMH series are high-power switching regulator modules housed in a low-profile, thermally optimized 25-pad LGA package measuring 12.19mm x 12.19mm x 3.75mm. Following RECOM’s 3D Power Packaging® design principles, these modules use a four-layer PCB with plugged and blind vias to achieve efficient heat dissipation and exceptional power density. With only 1.4cm² of surrounding PCB space, the modules can deliver full rated power up to 85°C without forced air cooling, achieving up to 800W/in³ at 90°C.
Features:
- High power density
- Low profile
- 0.5A, 1A, 1.5A, 2A, 3A, & 6A output current
- 4-65VDC input
- Adjustable output up to 28VDC
- Up to 99% efficiency, no need for heatsinks
- 6-sided shield for low EMI
- Wide operating temperature from -40°C up to +107°C at full load
- For battery-powered equipment, telecom, FPGA, or POL applications
- SCP, OCP, OTP, and UVLO protection
- No external components required
- Compact industry standard footprint
- Made in Europe
| Series | Current (A) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||||
|---|---|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPM-1.0
Focus
| 1 | 3 - 17 | 0.9 to 6 | SMD (pinless) | 25 pad LGA | |||
| 2 |
|
RPM-2.0
Focus
| 2 | 3 - 17 | 0.9 to 6 | SMD (pinless) | 25 pad LGA | |||
| 3 |
|
RPM-3.0
Focus
| 3 | 3 - 17 | 0.9 to 6 | SMD (pinless) | 25 pad LGA | |||
| 4 |
|
RPM-6.0
Focus
| 6 | 4 - 15 | 0.9 to 6 | SMD (pinless) | 25 pad LGA | |||
| 5 |
|
RPMB-2.0
Focus
| 2 | 4 - 36, 5.5 - 36, 12.8 - 36, 16 - 36 | 1 to 9, 9 to 24 | SMD (pinless) | 25 pad LGA | |||
| 6 |
|
RPMB-3.0
Focus
| 3 | 4 - 36, 5.5 - 36, 12.8 - 36, 16 - 36 | 1 to 9, 9 to 24 | SMD (pinless) | 25 pad LGA | |||
| 7 |
|
RPMH-0.5
Focus
| 0.5 | 4.3 - 65, 6 - 65, 13.5 - 65, 16.5 - 65, 25.5 - 65 | 15 to 28, 2.64 to 3.63, 4 to 5.5, 7.2 to 13.2, 9 to 16.5 | SMD (pinless) | 25 pad LGA | |||
| 8 |
|
RPMH-1.5
Focus
| 1.5 | 5 - 60, 7 - 60, 14 - 60, 17 - 60, 26 - 60 | 15 to 28, 2.64 to 3.63, 4 to 5.5, 7.2 to 13.2, 9 to 16.5 | SMD (pinless) | 25 pad LGA | |||
| 9 |
|
RPM-1.0-EVM-1
| 1 | 3 - 17 | 0.9 to 6 | Open Frame | ||||
| 10 |
|
RPM-2.0-EVM-1
| 2 | 3 - 17 | 0.9 to 6 | Open Frame | ||||
| 11 |
|
RPM-3.0-EVM-1
| 3 | 3 - 17 | 0.9 to 6 | Open Frame | ||||
| 12 |
|
RPM-6.0-EVM-1
| 6 | 4 - 15 | 0.9 to 6 | Open Frame | ||||
| 13 |
|
RPMB-2.0-EVM-1
| 2 | 4 - 36, 5.5 - 36, 12.8 - 36, 16 - 36 | 1 to 9, 9 to 24 | Open Frame | ||||
| 14 |
|
RPMB-3.0-EVM-1
| 3 | 4 - 36, 5.5 - 36, 12.8 - 36, 16 - 36 | 1 to 9, 9 to 24 | Open Frame | ||||
| 15 |
|
RPMH-0.5-EVM-1
| 0.5 | 4.3 - 65, 6 - 65, 13.5 - 65, 16.5 - 65, 25.5 - 65 | 15 to 28, 2.64 to 3.63, 4 to 5.5, 7.2 to 13.2, 9 to 16.5 | Open Frame | ||||
| 16 |
|
RPMH-1.5-EVM-1
| 1.5 | 5 - 60, 7 - 60, 14 - 60, 17 - 60, 26 - 60 | 15 to 28, 2.64 to 3.63, 4 to 5.5, 7.2 to 13.2, 9 to 16.5 | Open Frame |
RPX/RPY – Non-Isolated QFN Power Modules
The RECOM RPX series in an ultra-compact QFN package is widely used as a point-of-load (POL) DC/DC converter for loads requiring voltages down to 0.8V, such as CPUs, GPUs, and SoC devices with stringent regulation and low-noise requirements. High efficiency is essential for cool operation in space- and weight-sensitive designs like portable electronics. In industrial systems, the wide input voltage range offers greater safety margins for handling transient conditions. Traditionally, minimizing losses required low switching frequencies. However, RECOM’s 3D Power Packaging® technology, combined with advances in semiconductor and magnetic materials, allows MHz-range switching with high efficiency, enabling micro-miniaturized SMD power modules.
The RPX series footprint is just 3mm x 5mm x 1.6mm for 1A and 1.5A versions, 4.5mm x 4mm x 2mm for 2.5A, and 5mm x 5.5mm x 4.1mm for the 4A variant, which achieves over 90% peak efficiency. This high power density is possible thanks to flip-chip on leadframe construction with an integrated inductor and over-molding. This results in tight current loops for ultra-low EMI, along with optimized thermal performance — 3D Power Packaging® performance that cannot be matched by discrete designs.
The RPX series footprint is just 3mm x 5mm x 1.6mm for 1A and 1.5A versions, 4.5mm x 4mm x 2mm for 2.5A, and 5mm x 5.5mm x 4.1mm for the 4A variant, which achieves over 90% peak efficiency. This high power density is possible thanks to flip-chip on leadframe construction with an integrated inductor and over-molding. This results in tight current loops for ultra-low EMI, along with optimized thermal performance — 3D Power Packaging® performance that cannot be matched by discrete designs.
The RPY series is designed for programmable constant current applications up to 1.5A, making it ideal for high-power LED drivers. The QFN package measures 3mm x 5mm x 1.6mm.
The RPX-Q and RPY-Q variants are AEC-Q100 automotive qualified to +125°C and offer optional wettable flanks for automated optical inspection (AOI) of solder joints.
The RPX-Q and RPY-Q variants are AEC-Q100 automotive qualified to +125°C and offer optional wettable flanks for automated optical inspection (AOI) of solder joints.
Features:
- Constant voltage output: 1A, 1.5A, 2.5A, 4A (RPX, RPX-Q)
- Constant current output: max 1.5A (RPY-Q)
- 3.8–36VDC input voltage range
- Adjustable output voltage: 0.8–30VDC (RPX, RPX-Q)
- Adjustable output current: 0–100% (RPY-Q)
- Reliable operation over 110°C
- -Q variants AEC-Q100 automotive qualified to +125°C
- Overmolded leadframe design with substrate-embedded control IC
- Integrated FETs, inductors, and passives for simplified PCB design
- Excellent thermal performance for demanding environments
- Built-in SCP, OCP, OTP, and UVLO protection
- ON/OFF control functionality
- Minimal filtering required for Class A or B EMC compliance
| Series | Current (A) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||||
|---|---|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPX-0.5Q
Focus
| 0.5 | 4 - 36 | 0.8 to 34 | SMD (pinless) | QFN | |||
| 2 |
|
RPX-1.0
Focus
| 1 | 4 - 36 | 0.8 to 30 | SMD (pinless) | QFN | |||
| 3 |
|
RPX-1.5
Focus
| 1.5 | 4 - 36 | 0.8 to 30 | SMD (pinless) | QFN | |||
| 4 |
|
RPX-1.5Q
Focus
| 1.5 | 4 - 36 | 0.8 to 30 | SMD (pinless) | QFN | |||
| 5 |
|
RPX-2.5
Focus
| 2.5 | 4.5 - 28 | 1.2 to 6 | SMD (pinless) | QFN | |||
| 6 |
|
RPX-4.0
Focus
| 4 | 3.8 - 36 | 1 to 7 | SMD (pinless) | QFN | |||
| 7 |
|
RPX-4.0-EVM-1
Focus
| 4 | 4 - 36 | 1 to 7 | Open Frame | ||||
| 8 |
|
RPX-1.0-EVM-1
| 1 | 4 - 36 | 0.8 to 30 | Open Frame | ||||
| 9 |
|
RPX-1.5-EVM-1
| 1.5 | 4 - 36 | 0.8 to 30 | Open Frame | ||||
| 10 |
|
RPX-2.5-EVM-1
| 2.5 | 4.5 - 28 | 1.2 to 6 | Open Frame |
| Series | Current (A) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||||
|---|---|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPY-1.5Q
Focus
| 1.5 | 4 - 36 | 0.8 to 34.8 | SMD (pinless) | QFN | |||
| 2 |
|
RPY-1.5Q-EVM-1
Focus
| 1.5 | 4 - 36 | 0.8 to 34.8 | Open Frame |
RPX: Ultra compact QFN-package power modules
RPL – Integrated Inductor Non-Isolated Power Modules
The RPL series non-isolated DC-DC converter modules are available in 1A, 3A, 5A, 10A, and 20A peak output ratings, leveraging 3D Power Packaging® technology to achieve exceptional power density in compact SMD footprints. Requiring only input/output capacitors and voltage-setting resistors, these integrated inductor power modules include comprehensive control and protection features. For the 3A and 5A versions, remote sensing is supported, while all models provide ON/OFF control and power-good signaling. An integrated LDO regulator delivers a fixed 3.3VDC/20mA output suitable for logic pull-ups or external control circuitry.
The RPL-10 and RPL-20 additionally offer enable, tracking, and power-good connections to support power rail sequencing in distributed power architecture (DPA) systems. They also feature programmable operating frequency and adjustable start-up timing for flexible system integration. Using constant on-time control, the RPL series reacts rapidly to abrupt load transients, while a secondary slow control loop maintains output stability. This provides precise load regulation without compromise, making the series ideal for dynamic loads such as microcontrollers, RF transceivers, radios, or pulsed-current imaging systems.
The RPL-10 and RPL-20 additionally offer enable, tracking, and power-good connections to support power rail sequencing in distributed power architecture (DPA) systems. They also feature programmable operating frequency and adjustable start-up timing for flexible system integration. Using constant on-time control, the RPL series reacts rapidly to abrupt load transients, while a secondary slow control loop maintains output stability. This provides precise load regulation without compromise, making the series ideal for dynamic loads such as microcontrollers, RF transceivers, radios, or pulsed-current imaging systems.
Features:
- 1A, 3A, 5A, 10A, or 20A rating
- Tiny 3mm x 3mm x 1.45mm size (1A to 5A versions) or 7mm x 7mm (10A and 20A versions)
- Adjustable output down to 0.6VDC, up to 12VDC
- Wide input voltage range from 2.75VDC to 22V (variant dependent), covering 5, 12 or 15 VDC supply rails or battery-powered supplies
- Up to 96% efficiency (50% load)
- Wide operating temperature range (-40°C up to +120°C)
- SCP, OCP, OVP, and OTP protection
- Enable and power-good pins for simple power rail sequencing
- Meets EN 55032 EMC limits with simple LC filter components
- For distributed power architecture, portable equipment, imaging systems, and industrial applications
| Series | Iout 1 (mA) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||||
|---|---|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPL-1.0
Focus
| 1000 | 3 - 22 | 0.6 to 12 | SMD (pinless) | 11 pad LGA | |||
| 2 |
|
RPL-1.0-EVM-1
Focus
| 1000 | 3 - 22 | 0.6 to 12 | Open Frame | ||||
| 3 |
|
RPL-10
Focus
| 10000 | 4 - 16 | 0.6 to 5.5 | SMD (pinless) | 29 pad LGA | |||
| 4 |
|
RPL-10-EVM-1
Focus
| 10000 | 4 - 16 | 0.6 to 5.5 | Open Frame | ||||
| 5 |
|
RPL-20
Focus
| 20000 | 4 - 16 | 0.6 to 5.5 | SMD (pinless) | 29 pad LGA | |||
| 6 |
|
RPL-20-EVM-1
Focus
| 20000 | 4 - 16 | 0.6 to 5.5 | Open Frame | ||||
| 7 |
|
RPL-3.0
Focus
| 3000 | 4 - 18 | 0.8 to 5.2 | SMD (pinless) | 10 pad LGA | |||
| 8 |
|
RPL-5.0
Focus
| 5000 | 2.75 - 17 | 0.6 to 12 | SMD (pinless) | 24-Pad QFN | |||
| 9 |
|
RPL-5.0-EVM-1
Focus
| 5000 | 2.75 - 17 | 0.6 to 12 | Open Frame |
RPZ – Integrated Inductor Non-Isolated QFN Power Modules
The RPZ series is optimized for operation from fixed 3.3VDC, 5VDC, or a single Li-ion cell input. The 0.5A and 1A versions feature a 2mm x 2mm QFN footprint, while 2A and 3A models measure 2.5mm x 3.5mm, and the 6A variant comes in a 4mm x 6mm package. All models utilize thermally enhanced 3D Power Packaging® for reliable operation beyond +100°C without the need for forced-air cooling.
An innovative constant-on-time dual-speed control loop eliminates the delay caused by internal compensation networks, enabling ultra-fast voltage regulation for transient loads. This makes the RPZ series particularly suited for dynamic load applications such as microcontrollers, RF radios, or pulsed-current imaging systems. With conversion efficiency up to 92%, these modules deliver high power density in compact QFN designs. Only input/output capacitors and voltage-setting resistors are required for a complete regulator solution, which includes full protection and control features such as programmable undervoltage lockout (UVLO) to prevent Li-ion battery over-discharge. In shutdown mode, current draw drops to microamp levels, extending battery life in portable systems.
An innovative constant-on-time dual-speed control loop eliminates the delay caused by internal compensation networks, enabling ultra-fast voltage regulation for transient loads. This makes the RPZ series particularly suited for dynamic load applications such as microcontrollers, RF radios, or pulsed-current imaging systems. With conversion efficiency up to 92%, these modules deliver high power density in compact QFN designs. Only input/output capacitors and voltage-setting resistors are required for a complete regulator solution, which includes full protection and control features such as programmable undervoltage lockout (UVLO) to prevent Li-ion battery over-discharge. In shutdown mode, current draw drops to microamp levels, extending battery life in portable systems.
Features:
- 0.5A to 6A non-isolated SMD power modules
- QFN packages
- Adjustable output from 0.6V up to 6.65 VDC (RPZ-6.0)
- Wide 2.75-7 VDC input covering 3.3 or 5 rails for battery-powered supplies (RPZ-6.0)
- Up to 92% efficiency
- Wide operating temperature range (-40°C up to +110°C)
- SCP, OCP, OVP, and OTP protected
- Enable and power-good pins for simple power rail sequencing
- Meets EN55032 EMC limits with simple LC filter components
- For distributed power architecture, FPGA, ASIC or microcontroller
- Point-of-Load supplies, portable equipment, imaging systems and industrial applications
| Series | Current (A) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||||
|---|---|---|---|---|---|---|---|---|---|---|
| 1 |
|
RPZ-0.5
Focus
| 0.5 | 2.3 - 5.5 | 0.6 to 5.375 | SMD (pinless) | 10-Pad QFN | |||
| 2 |
|
RPZ-0.5-EVM-1
Focus
| 0.5 | 2.3 - 5.5 | 0.6 to 5.375 | Open Frame | ||||
| 3 |
|
RPZ-1.0
Focus
| 1 | 2.3 - 5.5 | 0.6 to 5.25 | SMD (pinless) | 10-Pad QFN | |||
| 4 |
|
RPZ-1.0-EVM-1
Focus
| 1 | 2.3 - 5.5 | 0.6 to 5.25 | Open Frame | ||||
| 5 |
|
RPZ-2.0
Focus
| 2 | 2.75 - 6 | 0.6 to 5.74 | SMD (pinless) | 18-Pad QFN | |||
| 6 |
|
RPZ-2.0-EVM-1
Focus
| 2 | 2.75 - 6 | 0.6 to 5.74 | Open Frame | ||||
| 7 |
|
RPZ-3.0A
Focus
| 3 | 2.75 - 6 | 0.6 to 5.5 | SMD (pinless) | 18-Pad QFN | |||
| 8 |
|
RPZ-3.0A-EVM-1
Focus
| 3 | 2.75 - 6 | 0.6 to 5.5 | Open Frame | ||||
| 9 |
|
RPZ-6.0
Focus
| 6 | 2.75 - 7 | 0.6 to 6.65 | SMD (pinless) | 24-Pad QFN | |||
| 10 |
|
RPZ-6.0-EVM-1
Focus
| 6 | 2.75 - 7 | 0.6 to 6.65 | Open Frame |
R-78AA-1.0 and ROF-78E – High-efficiency three-terminal linear regulator replacements
Over the years, high-efficiency switching regulator replacements for the traditional ‘78xx series’ linear regulators have been developed. Although ‘drop-in’ through-hole equivalent parts remain popular, compact surface-mount types are now preferred.
As one of the first manufacturers to introduce a switching regulator module, RECOM launched an encapsulated gull-wing, 1A-rated R-78AA-1.0 series with a wide input range up to 18V, allowing use of 5V, 9V, 12V, or 15V unregulated supplies. It provides fixed regulated outputs of 1.5V, 1.8V, 2.5V, or 3.3V in a volume of just 1.75cm³. For applications where a low-profile open-frame product is preferred, the RECOM ROF-78E series offers a 0.5A rating with a wider input range up to 36V and fixed output voltages of 3.3V, 5V, or 12V in just 0.68cm³.
As one of the first manufacturers to introduce a switching regulator module, RECOM launched an encapsulated gull-wing, 1A-rated R-78AA-1.0 series with a wide input range up to 18V, allowing use of 5V, 9V, 12V, or 15V unregulated supplies. It provides fixed regulated outputs of 1.5V, 1.8V, 2.5V, or 3.3V in a volume of just 1.75cm³. For applications where a low-profile open-frame product is preferred, the RECOM ROF-78E series offers a 0.5A rating with a wider input range up to 36V and fixed output voltages of 3.3V, 5V, or 12V in just 0.68cm³.
Isolated DC/DC Converters
When safety-agency-certified isolation is required, besides voltage withstand, minimum creepage and clearance distances are defined. For example, in medical applications with mains system voltages, 8mm creepage is required between input and output for two Means of Patient Protection (2MOPP). Given this minimum packaging dimension, a more traditional approach can be taken, with an internal die comprised of a power chiplet and control chiplet wire-bonded to a DVE SOIC16 leadframe, then conventionally over-molded – such as in the RECOM RxxCT(E) and RxxC05TE parts. The transformer in these low-power DC/DC converters is a proprietary, very low-profile, planar-type design, achieving up to 5 kVAC/1 min isolation voltage and reinforced, 2MOPP isolation. The overall height of these parts is only 2.50–2.65mm, making them suitable for card-type applications where the converter height is comparable to other surface-mount components.
RS12-Z – 12W isolated and regulated DC/DC converters, SIP format
The RS12-Z series delivers class-leading power density in a SIP8 format by leveraging planar transformer technology with advanced packaging and thermal design. Housed in a metal case, the series features high efficiency and operates at a full 12 W load up to +75°C with convection cooling only (24V input). Pinout is industry-standard with backwards-compatibility to 3W and 6W parts in the SIP8 format, enabling straightforward power upgrades. Minimal external filtering is required to achieve EN 55032 EMC compliance, Class A or B. The parts also include an output trim function, input under-voltage lockout, and continuous short-circuit protection. These converters are ideal when a wide input range is required, covering multiple nominal voltages.
Features:
- 12W in a SIP8 package
- 3kVDC functional isolation
- Fully regulated
- 4:1 input 9-36V or 18-75V
- Wide choice of output voltages
- High operating temperature
- On/off control
- Output trim
- Short circuit protection
- Safety agency certified
| Series | Power (W) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||||
|---|---|---|---|---|---|---|---|---|---|---|
| 1 |
|
RS12-Z
Focus
| 12 | 9 - 36, 18 - 75 | 10.8 to 13.2, 13.5 to 16.5, 2.97 to 3.63, 21.6 to 26.4, 4.5 to 5.5 | THT | SIP8 |
R1SX, R2SX, R1DX, R1ZX – Surface-Mount Isolated DC/DC Converters
The R1SX, R2SX, R1DX, and R1ZX series are low-power, surface-mount isolated DC/DC converters featuring RECOM’s unique 3D packaging technology. A custom plastic molding supports the control PCB, which serves as the top surface of the module, while the isolation transformer is mounted underneath. This space-efficient design minimizes footprint and height, with module profiles ranging from 5.8mm to 8.5mm, depending on the series.
The open-frame construction is particularly valuable when surface-mount reflow soldering profiles are too demanding for potted or molded parts. The R1SX series offers 1W single-output operation up to +100°C, while the R1DX series delivers 1W dual outputs, both with 3kVDC/1 second isolation and safety agency certification. The R1ZX series is similar to the R1SX but adds an integrated linear regulator for precise, low-noise outputs with 2kVDC/1 second isolation. For higher power needs, the R2SX series delivers 2W up to +75°C, or +100°C with derating, and withstands 3kVDC/1 second isolation. All devices feature industry-standard, surface-mount pin-outs for cross-family compatibility, making them ideal for bus isolators, industrial control systems, and battery management applications.
The open-frame construction is particularly valuable when surface-mount reflow soldering profiles are too demanding for potted or molded parts. The R1SX series offers 1W single-output operation up to +100°C, while the R1DX series delivers 1W dual outputs, both with 3kVDC/1 second isolation and safety agency certification. The R1ZX series is similar to the R1SX but adds an integrated linear regulator for precise, low-noise outputs with 2kVDC/1 second isolation. For higher power needs, the R2SX series delivers 2W up to +75°C, or +100°C with derating, and withstands 3kVDC/1 second isolation. All devices feature industry-standard, surface-mount pin-outs for cross-family compatibility, making them ideal for bus isolators, industrial control systems, and battery management applications.
Features:
- Industry standard surface-mount pin-out, common across the family
- Selection of input and output voltages
- Dual outputs available (R1DX)
- Isolation up to 3kV/1 second (2kV R1ZX)
- High efficiency
- No minimum load requirement
- 1W output over a wide temperature range (R1SX, R1DX, R1ZX)
- 2W output (R2SX)
- Ideal for communication interface power isolation and general use
- Safety agency certified
RxxCT(E), RxxC05TE, RxxC1TFxxS, and RxxC2Txx – Isolated SOIC16 DC/DC Converters
The R05CT05S delivers a line- and load-regulated output with an external enable, operates from -40°C up to +140°C, and provides 500mW from a 5V input with selectable 5V or 3.3V outputs. This model is particularly suited for powering isolated interfaces in medical electronics and industrial systems thanks to compliance with IEC/EN 60601-1 and IEC/EN 62388-1.
The R05CTE05S offers a lower-cost alternative with a semi-regulated 5 V output, 3kVDC/1min basic isolation, and an operating range from -40°C to +125°C. It doubles the power to 1000mW from a 5V input and, with automated manufacturing, is well-suited for isolated interfaces in high-reliability industrial applications. It is IEC/EN 62388-1 compliant.
The R05C05TE05S provides an even more cost-effective solution with a semi-regulated 5V output, 3kVDC/1min isolation, and -40°C to +125°C operation. It supplies 500mW (600 mW peak) from a 5V input and is also manufactured via a fully automated process for consistent performance in high-reliability industrial designs. IEC/EN 62388-1 compliant.
The RxxC1TFxxS series comes in an ultra-compact 5mm × 4mm × 1.2mm LGA package, supports both 3.3V and 5V input rails, and features a pin-selectable regulated and protected output. With 3 kVAC/1 s isolation and a wide -40°C to +80°C operating range without derating, it is ideal for isolated communication ports, industrial automation, IoT nodes, and sensor isolation in high-reliability systems.
The RxxC2Txx series is a programmable regulated output converter enabling gate driver circuit designers to fine-tune supply voltages. Positive and negative outputs can be independently set via resistor dividers between +2.5V to +22.5V and -2.5V to -22.5V, as long as the total voltage is >18V and <25V. Example configurations include +20/-5V, +18/-9V, ±12V, +18/-4V, or +15/-3V from a single device.
The R24C2T25 variant offers 3 kVAC/1min isolation, operates from -40°C to +100°C at 1.5W load, and features low isolation capacitance of 3.5pF with high 150kV/µs CMTI — making it ideal for IGBT, Si-MOSFET, SiC, and GaN isolated gate driver power supplies.
The RxxCT(E) and RxxC05TExxS series are available in cut-tape (-CT) or tape-and-reel (-R) packaging.
The RxxC2Txx series is a programmable regulated output converter enabling gate driver circuit designers to fine-tune supply voltages. Positive and negative outputs can be independently set via resistor dividers between +2.5V to +22.5V and -2.5V to -22.5V, as long as the total voltage is >18V and <25V. Example configurations include +20/-5V, +18/-9V, ±12V, +18/-4V, or +15/-3V from a single device.
The R24C2T25 variant offers 3 kVAC/1min isolation, operates from -40°C to +100°C at 1.5W load, and features low isolation capacitance of 3.5pF with high 150kV/µs CMTI — making it ideal for IGBT, Si-MOSFET, SiC, and GaN isolated gate driver power supplies.
The RxxCT(E) and RxxC05TExxS series are available in cut-tape (-CT) or tape-and-reel (-R) packaging.
Features:
- Post-regulated 0.5W and 1W output
- Ultra-low profile: 2.5mm (RxxCTE, R05C05TE) or 2.65mm (RxxCT)
- Selectable outputs: 3.3V or 5VDC (RxxCT) or fixed 5V (RxxCTE, R05C05TE)
- Wide operating temperature: -40°C to +140°C (RxxCT) or up to +125°C (RxxCTE, R05C05TE)
- 5kVAC/1min reinforced isolation (RxxCT) or 3 kVDC/1 min basic isolation (RxxCTE, R05C05TE)
- Suitable for medical devices, COM port isolation, transceiver isolation, and high-voltage current sensing
- Meets CISPR32 Class B EMC limits
- Safety compliance: EN 62368-1 (RxxCT, RxxCTE, R05C05TE) or IEC/EN 60601-1 with 2MOPP (RxxCT)
- Fully protected: SCP, OCP, OTP, UVLO
| Series | Power (W) | Vin (V) | Main Vout (V) | Mounting Type | Package Style | |||||
|---|---|---|---|---|---|---|---|---|---|---|
| 1 |
|
R12C2T12/R
Focus
| 2.5 | 9 - 18 | SMD | 36-Pin SSOP | ||||
| 2 |
|
R12C2T25/R
Focus
| 2.5 | 9 - 18 | SMD | 36-Pin SSOP | ||||
| 3 |
|
R15C2T25/R
Focus
| 2.5 | 13.5 - 18 | SMD | 36-Pin SSOP | ||||
| 4 |
|
R24C2T25
Focus
| 2.5 | 21 - 27 | SMD | 36-Pin SSOP | ||||
| 5 |
|
R24C2T25/R
Focus
| 2.5 | 21 - 27 | SMD | 36-Pin SSOP | ||||
| 6 |
|
R9C1T18/R
Focus
| 3 | 8.5 - 18 | SMD | 36-Pin SSOP | ||||
| 7 |
|
RxxC05TExxS
Focus
| 0.5 | 5 | 5 | SMD | SMD 16 Pin | |||
| 8 |
|
RxxC1TFxxS
Focus
| 1 | 5 | 5 | SMD (pinless) | 12 pad LGA | |||
| 9 |
|
RxxCTExxS
Focus
| 1 | 5 | 5 | SMD | SMD 16 Pin | |||
| 10 |
|
RxxCTxxS
Focus
| 0.5 | 5 | 5 | SMD | SMD 16 Pin |
Order the RECOM evaluation board showcasing latest 3D Power Packaging® technology to permit rapid prototyping or to confirm the performance in the end application.
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