Wide Bandgap Semiconductors (SiC and GaN)
Of course, the first new materials that we should mention are
Silicon Carbide (SiC) and
Gallium Nitride (GaN), two wide bandgap semiconductors that are rapidly replacing silicon in multiple power applications. SiC and GaN power devices operate at higher temperatures and frequencies than traditional silicon components, allowing for more efficient power conversion in existing designs and even enabling the use of new topologies that are not feasible with silicon devices.
Power supplies utilizing these materials can be more compact and lightweight, with improved overall performance. SiC devices are gaining traction in high-efficiency data center rack-mounted power supplies; GaN is popular for low-power applications such as laptop and phone chargers. There is expected to be considerable overlap between SiC and GaN in medium power applications as both materials expand their performance envelope.
Thermal Interface Materials
Effective heat dissipation is essential for maintaining the reliability, efficiency, and longevity of electronic components in a power supply. Thermal interface materials are placed between a heat-generating device, such as a power transistor, and a heat-dissipating component, such as a heat sink. These materials include thermal adhesives, pads, pastes, and gaskets, all of which are crucial for efficient heat transfer. New thermal gels with high thermal conductivity and improved resistance properties help manage heat generated by power electronics, enhancing system reliability and performance.
Looking further ahead, graphene and
carbon nanotubes are being explored for thermal management applications in power supplies. These materials offer excellent thermal conductivity, making them suitable for heat dissipation solutions in high power density environments.
RECOM Takes Advantage of Material Science Advances
RECOM products take full advantage of these material science advancements as they align with our stringent quality standards and are incorporated into volume production. Many of these improvements may not be immediately noticeable to the customer but result in higher efficiency, extended temperature operation, and greater reliability.
The new
RKK series, for example, is an upgrade to the existing
RKE/
RFMM series, a 1W unregulated, isolated, SIP-7 DC/DC. The RKK features improved magnetics with a
planar transformer, lower EMI, operation up to 105°C with no derating, an extended lifetime, and higher efficiency that remains stable at light loads. The elimination of potting reduces cost and weight, nearly halving it to just 1.7g, adding to its ‘green’ credentials. An additional new series,
RYK, has a fully linear-regulated output with similar enhancements.
Conclusion
Ongoing research and innovations in materials science continue to shape the evolution of power supply technologies. Advances are occurring across a broad front, benefiting power supplies with improved semiconductor materials, dielectrics, insulators, sustainability, and more.
Incorporating these advanced materials into power supply design contributes to improvements in efficiency, reliability, miniaturization, and sustainability. RECOM engineers are constantly evaluating new components that employ these materials and integrating them into our designs where beneficial.
