Introducing RECOM 3D Power Packaging® (3DPP)

3DPP stands for 3D Power Packaging®, a new offering of cutting-edge, surface mount DC/DC converters that deliver best-in-class performance without the costly footprint. RECOM’s newest assembly process allows for maximum power density and minimal footprints, resulting in significantly smaller modules than other power conversion solutions. For example, our RPMB-3.0 series is a 36V 3A SMD complete power module that fits in a 12.2x12.2x3.75mm shielded casing and achieves up to 94% efficiency without the need for any additional components.

In addition to their compact size, 3DPP products enable the implementation of modern reflow soldering assembly, which simplifies supply chain and manufacturing processes compared to more traditional through-hole power solutions.

3DPP technology eliminates the need for an internal PCB by mounting intrinsic components directly to a lead frame, thereby reducing the space required for conversion components within the module. As an example, one of the newly available 3DPP switching regulator products, the RPX-1.0, measures only 3mm x 5mm x 1.6mm, making it nearly as small as an IC. This reduction in size allows engineers and designers to create more streamlined PCB profiles with integral power conversion without requiring costly, custom-designed solutions.

3DPP-enabled devices are available in multiple package types, including LGA, gull-wing, QFN, blocks-and-pillars, and solder balls, offering flexibility in space-constrained applications. Beyond size reduction, 3DPP technology enhances thermal performance. The compact form factor reduces the overall thermal load, potentially eliminating the need for additional thermal management components and simplifying design processes. By removing bond wires and placing the converter IC directly on a lead frame, thermal resistance is significantly lowered, shortening power paths on the PCB and enabling higher switching frequencies while maintaining EMC compliance.

While some applications may require a few passive external components, most filtering is done internally, and some models even integrate an inductor. The tight switching current loops within these products inherently reduce EMI, making them valuable in EMC-critical environments.

3DPP can be used in any application requiring a minimal converter footprint, high switching frequencies, or reduced EMI. Industries such as medical, mobility, energy, IoT, communication/5G, and automotive have adopted 3DPP technology for its outstanding performance and compact design. For example, RECOM’s RxxCTxxS series is a medical-grade DC/DC converter ideal for communication, current sensing, and medical applications requiring high isolation. As with many other RECOM products, evaluation boards are available for component validation and prototyping.

For more information on 3DPP products or to order a RECOM evaluation board showcasing the latest 3D Power Packaging^® technology, contact info@recom-power.com