Advanced packaging technology can help achieve key Industry 4.0 goals
Advanced packaging technology for DC/DC converters can help improve efficiency, reduce size, and even reduce cost. The desire for more compact power supplies has led to devices that integrate the transformer, control device, power transistors, and other components into a single package.
However, the footprint must remain small to realize the advantages of a module over a discrete design. To achieve this, non-isolated DC/DC switching regulators and isolated converter modules utilize the z-direction by integrating 3D assembly techniques for minimum footprint and maximum power density. Internally, the device mounts a low-cost flip chip on a lead frame and adds an integrated inductor with over-molding.
The 3D construction also lends itself to increased efficiency: The components are situated in extremely close proximity to each other, resulting in tight switching current loops that generate very low EMI, along with high power density and optimized thermal performance that exceeds that of discrete designs.
So far, so good. But in the quest for ever-higher product reliability at lower cost, modern electronic manufacturing lines are moving toward eliminating hand assembly, including hand soldering, wherever possible. The two standard automated soldering operations—wave and reflow—require components that use surface-mount technology (SMT) packaging. Almost all electronic components, such as data converters, microcontrollers, and passives, are available in this format. Traditionally though, through-hole SIP packages are often used for integrated DC/DC converters because they minimize the PCB footprint, even though they can complicate the assembly by requiring an additional hand-soldering step that is a potential source of error.
Conclusion
Industry 4.0 imposes stringent reliability, size, and efficiency requirements on DC/DC converters. RECOM’s low-power
isolated and
non-isolated DC/DC converters use advanced packaging technology that improves product reliability, lowers cost, and helps boost efficiency—all in best-in-class package sizes.