Advanced DC/DC Converters Packaging Helps Industry 4.0 Achieve Key Goals

The history of manufacturing since the 18th century includes four loosely defined “industrial revolutions” that gradually replaced human and horsepower with increasing levels of mechanization. The first stage of mechanization relied on power from water and steam. In the second stage, there was a shift to electrical power and the introduction of mass production and the assembly line, while computers and automation characterized stage three. Each stage enabled greater production flexibility, more efficient use of power, and reduced costs compared to its predecessor.

We are now well into the fourth stage, often called Industry 4.0. It builds on stage three by adding robotic technologies, large-scale data gathering from Internet of Things (IoT) devices, and a cloud-based component that increasingly includes machine learning (ML) and artificial intelligence (AI). In manufacturing, Industry 4.0 is synonymous with the smart factory, where automated systems make decisions about local processes, communicate and cooperate with each other, and interact with human operators in real time—both on-site and via the cloud.

Advanced packaging technology for DC/DC converters can enhance efficiency, reduce size, and lower cost. The demand for more compact power supplies has driven the development of devices that integrate the transformer, control circuitry, power transistors, and other components into a single package.

To retain the benefits of modular designs over discrete implementations, the overall footprint must remain small. To achieve this, non-isolated DC/DC switching regulators and isolated converter modules make use of the z-axis by incorporating 3D assembly techniques—minimizing footprint while maximizing power density. Internally, these devices typically mount a low-cost flip chip on a lead frame and include an integrated inductor with over-molding. The 3D construction also lends itself to increased efficiency: components are situated in extremely close proximity, resulting in tight switching current loops that generate very low EMI, along with high power density and optimized thermal performance that exceeds that of discrete designs.

So far, so good. But in the pursuit of ever-higher product reliability at lower cost, modern electronic manufacturing lines are increasingly eliminating hand assembly, including hand soldering, wherever possible. The two standard automated soldering operations—wave and reflow—require components that use surface-mount technology (SMT) packaging. Almost all electronic components, such as data converters, microcontrollers, and passives, are available in this format. Traditionally, however, through-hole SIP packages have often been used for integrated DC/DC converters because they minimize PCB footprint, even though they can complicate assembly by requiring an additional hand-soldering step—a potential source of error.

Industry 4.0 imposes stringent requirements for reliability, size, and efficiency in DC/DC converters. RECOM’s low-power isolated and non-isolated DC/DC converters leverage advanced packaging technology to enhance product reliability, reduce cost, and improve efficiency—all within best-in-class compact package sizes.