RVS002 系列
RVS002 是一款紧凑型桥式整流芯片，专为空间受限环境中的微功率隔离电源应用而设计。配合变压器驱动芯片与变压器使用时，仅需简单的输出滤波电容，即可构成一套完整的隔离电源系统，其输出电压范围为 2–6V，输出功率在 1W～3W 之间。
RVS002 集成两颗 N 沟道功率 MOSFET 与两颗肖特基二极管，构成全桥整流结构。该设计可在变压器副边仅使用单绕组实现整流，显著简化变压器设计、缩小体积并降低成本。
芯片内置智能电压限制器，可防止空载条件下输出电压过度升高，保证电压稳定。当电源带载工作时，该限压模块不工作、无损耗，从而在满载条件下保持高效率。
| 产品编号 | 功率（W） | 输入电压（V） | 输出电压 1（V） | 输出电流 1 (mA) | 隔离电压 (kV) | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1 |
|
RVS002-FB-CT
重点
新
| 2 - 6 |
|
|
)
|
||||||||
| 2 |
|
RVS002-FB-R
重点
新
| 2 - 6 |
|
|
)
|
IC 与变压器组合方案，板载 / 分立器件任意选
| 产品编号 | 功率（W） | 隔离电压 (kV) | 输入电压（V） | 主输出电压（V） | 原边 IC | 变压器 | 副边 IC | |||
|---|---|---|---|---|---|---|---|---|---|---|
| 1 |
DS-RVP001-RMR-028-RVS002-0505-1
新
| 1 | 7 | 5 | 5 |
RVS002
|
| 特性 | RVS002 |
|---|---|
| Product Category | IC |
| 输入电压（V） | 2 - 6 |
| 主输出电压（V） | 2 ‐ 6 |
| 输出电压范围（V） | 2 - 6 |
| MAX Iout (mA) | 300 |
| 安装类型 | SMD (无引脚） |
| 封装类型 | DFN2x2-6 |
| 长度 (mm) | 2.1 |
| 宽度 (mm) | 2.1 |
| 高度 (mm) | 0.8 |
| 最低工作温度 (°C) | -40 |
| 最高工作温度 (°C) | 125 |
| 保护功能 | OVP |
| 指令 | Halogen-free, REACH, RoHS 2+ (10/10) |
| 质保 | 1 Year |
| Config | 1 Channel |
| 拓扑结构 | Bridge Rectifier |
| Number of Phases | 1 |
| MIN Storage Temperature (°C) | -55 |
| MAX Storage Temperature (°C) | 150 |
| 产品编号 | 功率（W） | 输出电压 1（V） | 输入电压（V） | 安装类型 | |||||
|---|---|---|---|---|---|---|---|---|---|
| 1 |
|
RVS002-FB-CT
重点
新
| 2 - 6 | SMD (无引脚） |
|
|
|||
| 2 |
|
RVS002-FB-R
重点
新
| 2 - 6 | SMD (无引脚） |
|
|
文件
| 标题 | 类型 | 日期 |
|---|---|---|
| RVS002.pdf | Datasheet | |
| RVS002_SPICE.zip | Simulation Model | 2026-3-19 |
Links
| 标题 | 类型 | 日期 |
|---|---|---|
| 隔离式 DC/DC 转换器：采用分立方案，还是使用集成模块？ | Whitepaper | 2026-5-11 |
| RECOM 正式进军分立式电源领域 | Official Press Release | 2026-3-25 |
| 面向分布式电源架构的隔离式 DC/DC 电源IC及分立电源解决方案 | Blog Article | 2026-3-13 |
Important parameters include input voltage range, output voltage, maximum load current, switching frequency, efficiency, size, and thermal performance. Selection involves balancing these factors to meet the specific requirements of your application, ensuring the IC operates within its safe thermal and electrical limits while minimizing PCB space.
A boost converter increases the input voltage to a higher output voltage using an inductor, low-side switch, a rectifier, and output filter.
A buck converter reduces the input voltage to a lower output voltage using a high-frequency high-side or low-side switch, an inductor, a rectifier, and output filtering.
A buck‑boost converter can both increase and decrease the output voltage in relation to the input voltage using one or more inductors, a high-side or a low-side switch, rectifiers, and output filtering.
A DC/DC controller IC manages the switching behavior of external power components such as MOSFETs, inductors, and transformers.
A DC/DC converter IC converts one DC voltage level to another using switching techniques and integrated control circuitry.
A synchronous converter replaces the traditional rectifier diode with a MOSFET, which reduces conduction losses and significantly improves efficiency.
An asynchronous converter uses a diode as the rectification element, resulting in a simpler design but typically lower efficiency compared to synchronous alternatives.
A converter IC typically integrates the power switches internally, providing a more compact solution. In contrast, a controller IC manages the switching behavior of external power components such as MOSFETs, inductors, and transformers.
Buck-boost converters are commonly used when the input voltage can vary above and below the desired output voltage. For example, this topology is ideal for maintaining a 12V fixed voltage from a 12V battery supply, where the battery level may fluctuate during discharge or charging.
Push-pull and full bridge topologies are often unregulated, making them best suited for use with regulated input voltage rails. Push-pull is preferred for 3.3V and 5V input voltage rails because the input current is shared between the switching transistors, allowing more power to be extracted from a smaller IC package. Full Bridge is preferred for 5V up to 24V input voltage rails because the input voltage stress is shared between the switching transistors, enabling it to efficiently switch higher input voltages. For regulated output voltages, wider input voltage ranges, or higher output power applications, Flyback is the preferred topology due to its versatility and ability to provide galvanic isolation.
Power ICs enable efficient switching topologies, optimized control algorithms, and fast switching frequencies that minimize power losses.
Key advantages include high integration, a small footprint, and improved efficiency. Integrated power ICs allow designers to create optimized power solutions tailored specifically for unique applications.
Power ICs typically require more external components and careful PCB design. This requirement for additional external parts and complex layout increases overall development complexity.
Common types include DC/DC converter ICs, PWM controller ICs, gate driver ICs, PMICs, linear regulators, and battery management ICs.
Power ICs are used in industrial electronics, telecom systems, consumer electronics, automotive systems, and IoT devices.
A power IC (power integrated circuit) is a semiconductor device designed to regulate or convert electrical power. It integrates essential functions such as feedback regulation, switching control, protection, and power management into a single chip.
A PMIC is an integrated circuit designed to manage power distribution within complex electronic systems. It typically integrates multiple voltage regulators, power sequencing, battery management, and system monitoring functions into a single semiconductor device.
A power IC is a semiconductor controller chip that requires external magnetic components such as inductors or transformers but often includes integrated power switching transistors. A power module integrates many of these discrete components into a single packaged solution, simplifying PCB design and reducing overall development time.
Power switching transistors differ primarily in how they are controlled, their switching speed, maximum switching voltage, and their power-handling limits. The main types include MOSFETs (up to 100kHz, 600V, 1kW), SiCs (up to 500kHz, 3.3kV, 100kW), GaNs (up to 1MHz, 900V, 10kW), and IGBTs (up to 50kHz, 6.5kV, 1MW).
MOSFETs are most often used in switching power supplies due to their low cost and ease of integration. SiCs and GaNs are utilized for high-frequency switching applications, while IGBTs are preferred for very high power or high-voltage switching.
MOSFETs are most often used in switching power supplies due to their low cost and ease of integration. SiCs and GaNs are utilized for high-frequency switching applications, while IGBTs are preferred for very high power or high-voltage switching.
Power ICs are often utilized when designers require maximum flexibility, lower cost at high volumes, or highly customized power architectures.